Troubleshooting Test Noise in Xizhi Nanochips – Xizhi (Demo)

Overview

During initial evaluation, some customers may observe higher-than-expected signal noise or instability. This guide outlines common causes and solutions to ensure optimal chip performance.

This article covers:

Symptoms of test noise
Root causes
Recommended corrective actions
When to escalate to Xizhi Support

1. Symptoms of Test Noise

Measured signals show random fluctuations beyond datasheet specifications.
Device output degrades under thermal cycling.
Performance drifts after extended operation (>12 hours).

2. Common Root Causes

Environmental interference: Electromagnetic noise from nearby equipment.
Power instability: Ripple or grounding issues in test setup.
Improper packaging removal: Residual moisture or particles on chip surface.
Thermal mismatch: Test board heating above recommended limits.

3. Corrective Actions

Step 1: Verify Environment

Ensure test equipment is placed on a vibration-isolated table.
Eliminate nearby high-frequency sources (RF amplifiers, motors).

Step 2: Check Power Supply

Use low-noise linear power supplies with <1 mV ripple.
Confirm proper grounding across all test instruments.

Step 3: Inspect Chip Surface

Under a microscope, check for condensation or dust particles.
If contamination is found, gently clean with nitrogen blow-off.

Step 4: Monitor Thermal Conditions

Keep device junction temperature < 85 °C.
For high-power tests, apply active cooling (fan or liquid).

4. When to Contact Support

If noise persists after corrective actions:

Export oscilloscope or analyzer logs.
Note the chip batch number and test setup diagram.
Submit a support ticket with attached data.

Xizhi engineers will analyze the logs and may request additional test parameters.